英语翻译Thermoplastic Injection Molding:New Packages and 3D Circ

英语翻译
Thermoplastic Injection Molding:New Packages and 3D Circuits
Abstract
Thermoset epoxies,discovered nearly 80 years ago,remain the workhorse materials for electronic packaging and printed
circuit boards,but this may change with increasing technical,economic and regulatory demands.Modern halogen-free
thermoplastics boast superior properties and automated high-efficiency high-volume processes.Injection molding can readily
produce intricate 3D structures suitable for packaging and 3D molded circuits.Although there is a well-established packaging
infrastructure geared to thermoset epoxies there is a much larger world-wide manufacturing base that excels in thermoplastics.
Nearly 16-billion pounds of thermoplastics are molded into parts each year in the USA alone; 30 times higher than for
epoxies.The time may be right for adding thermoplastic packages,interconnects and circuitry to 21st century electronics.
This paper will discuss concepts,novel designs,new processes and the advancements for injection molded packaging and
highlight their impressive attributes; the lowest moisture uptake,the fastest processing and the highest stability in the world
of polymers.While MEMS packaging will be a central theme,general component packaging will also be discussed including
power packages and camera modules.The discussion will include the development of new BGA concepts that utilize
automatic insert-molding of tiny metal balls to create the 1st and 2nd level interconnect system.Assembly topics will cover
package sealing methods that include laser welding.
New Multi-Chip Package (MCP) ideas based on insert-molded flex will be described that could find use in stackable designs.
Hermeticity is discussed using data to show that plastics are near-hermetic but do not yet pass MIL-STD levels.But,future
work with barrier coatings may eventually lead to a low cost full hermetic plastic package.And finally we’ll look at 3D
molded circuits,now called MID (Molded Interconnect Devices),and search for new applications.Conductor patterning
methods include molding with plating-catalyzed resin and direct laser writing.We will also consider the idea of combining
molded circuitry and packaging for maximum synergy.
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热注塑成型：新封装法和3D电路
摘要
环氧热固树脂大约在80年前被人们发现后一直是电子封装和印刷电路板的主要材料.但随着技术、电子和管理需求提升,这一现象将会得到改变.现代无卤素热塑性塑料具备优良的性能,能够高效、自动化、大批量的加工.
注塑成型容易为封装和3D模制电路生产复杂的3D结构.虽然已经有适合加工环氧热固树脂的优良包装基础设备,但全球更大的制造基地在热塑性塑料方面更为优秀.仅美国每年就有近160亿磅的热塑性材料模压成零件,是环氧树脂的30倍.这个时候在21世纪电子产品中添加热塑性封装、连接件以及电路系统是合适的.
本文将叙述注塑模封装的概念、创新设计、新工艺及其先进性,重点突出聚合体产业其特性,低吸湿性,快速加工和较高的稳定性.但MEMS包装将是主题,也会谈到普通封装（包括动力包装和照相机模块组件）.
本文还将讨论BGA新概念的发展即利用微型金属弹珠自动插入成型以此形成1级和2级互连系统.
装配将涵盖到封装密封方法包括激光焊接法.
本文叙述了基于嵌入模弯曲的多芯片新理念,可应用于堆叠设计.谈到密封性时,数据显示塑料近乎密封但仍未能通过MIL-STD级别.但防护涂层未来的工作最终可能导致整个密封塑料封装成本低.最后我们来看一下3D模制电路,现在称之为MID（模制互连组件）,搜索新的应用.导体成型方法包括涂催化剂树脂成型和激光直接写入.我们也将尝试联合运用模制电路系统和封装做为最佳组合.